Product Description:
UL /IEC/ EN 60950 IEC61032 Test Probe Kits
Model:BND-TPK01
Product Details:
The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:
· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)
· 50mm Impact Test Ball (BND-G500R)
· Test Pin Probe: short (BND-13)
· Rigid Finger Probe (BND-11)
· Ball Pressure Tester (BND-QY102)
· Telecom Test Probe (BND-TB12)
Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950
Datasheets of BND-TPK01 test probe kit:
test probe B | ![]() | IEC61032 IEC60950 IEC60335 IEC60529 IEC60045 IEC60884 IEC60745 | Knurled Finger Diameter:12mm Knurled Finger Length:80mm Baffle Plate Diameter:50mm Baffle Plate Length:100mm Baffle Thickness:20mm |
BND-G500R Test Sphere 500G with ring | ![]() | IEC61032 IEC60529 | Diameter:50mm Weight:227g |
BND-13 Short Test Pin | ![]() | IEC60065 IEC60335 IEC61032 | The probe Diameter:Head 3mm Tail 4mm The probe Length:15mm Dam-board Diameter:25mm Dam-board Thickness:4mm |
BND-11 Rigid Test Probe 11 | ![]() | IEC61032 IEC60065 IEC60335 IEC60884 | Nodular Finger Length:80mm Nodular Finger Diameter:12mm Dam-board Diameter:50mm Dan-board Thickness:5mm |
BND-TB12 12mm Telecom Test Probe | ![]() | IEC60065 IEC60695 IEC60950 | Probe Diameter:12mm Probe Length:80mm Baffle Plate Diameter:50mm |
BND-QY102 Ball Pressure Apparatus | ![]() | IEC60695-10-2 IEC60884 IEC60320 IEC60335 IEC60598 IEC60950 | Ball diameter:5MM Total test pressure:20N±0.2N Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder |